http://www.dynatex.com/docs/wafergrip-adhesives/WaferGrip_Tech_Data_Sheet.pdf WebText: ±0.5 Degrees Dicing Tape: Adwill D-175 Film Frame: Disco Maximum Total Die Count: 400 276mm Notes Original: PDF ST9M111-S ST9M111-G GXMK14L WX2K14L 565RGB, 555RGB, 444RGB 48-Pin 09005aef82c9abba/ 09005aef8274210c : 2007 - adwill d-175. Abstract: adwill D-176 Adwill D-174A adwill
Technical data sheet download Large-sized printing related …
WebOffers excellent cutting performance for a wide range of applications from processing of hard and brittle materials to substrate dicing. The Z05 Series electro-formed bond blades employ new DISCO advances in the materials and manufacturing process. By employing the new element technology, the Z05 series allows to select bond from two types. WebAutomatic Dicing Saw, DAD3221 Datasheet, DAD3221 circuit, DAD3221 data sheet : DISCO, alldatasheet, Datasheet, Datasheet search site for Electronic Components and Semiconductors, integrated circuits, diodes, … hierarchical structural organisation
Semiconductor Wafer Tape SWT 20+R Nitto in Europe
Webproblems with saw dicing of modern semiconductors. This approach takes advantage of the KerfAid base formulation while specifically targeting such issues as resistivity, surface … Webapplications including wafer dicing and wafer thinning. WaferGrip on Mylar is used as a temporary substrate that allows the user to cut through the wafer into the substrate … WebA dicing adhesive sheet having a base film and an adhesive layer formed on the base film is characterized in that the thickness of the adhesive layer ranges from 1 to 10 µm and the adhesive layer has an application temperature such that the adhesion measured when 180 °C peeling at 23 °C of the dicing sheet is conducted (the peeling speed is 300 mm/min) … hierarchical star